爱玩客

SK海力士将采用英特尔EMIB封装技术：打造下一代HBM_我的网站

A |     8月24日消息，据Wccftech报道，SK海力士近日详细阐述了其HBM技术路线图的加速路径，核心举措包括引入EMIB封装方案，并明确将3D集成作为长期目标。     当前，HBM通过TSV（硅通孔）技术将多层DRAM芯片堆叠于基础裸片之上，最高可支持16层堆叠。    E-commerce giant Amazon is under investigation by the UK's competition watchdog over claims it favors its own warehouses over third-party sellers.,The Competition and Markets Authority (CMA) will look into whether customers are getting a "worse deal" due to the online retailer giving an unfair advantage to its retail arm or sellers who use its services in the Amazon UK Marketplace.,In particular, the probe will examine how Amazon uses third-party retailers' data and its criteria for access to the "Amazon Prime" service, which includes free deliveries. It will also look at how Amazon decides which company's product has the privilege of featuring in the instant "Buy Box" on the website's home page.,"Millions of people across the UK rely on Amazon's services for fast delivery of all types of products at the click of a button," said CMA general counsel Sarah Cardell. "This is an important area so it's right that we carefully investigate whether Amazon is using third-party data to give an unfair boost to its own retail business and whether it favours sellers who use its logistics and delivery services - both of which could weaken competition.",Bezos’ $500M Megayacht Stranded After Dutch Firm Abandons Bid to Dismantle Rotterdam Bridge3 July, 04:03 GMT,"Thousands of UK businesses use Amazon to sell their products and it is important they are able to operate in a competitive market," Cardell added. "Any loss of competition is a loss to consumers and could lead to them paying more for products, being offered lower quality items or having less choice.",Billionaire Amazon founder Jeff Bezos also owns the liberal US Washington Post newspaper. The company has been criticized for its treatment of warehouse staff and its resistance to recognizing trade unions.。HBM与计算模块（XPU，涵盖GPU、TPU等）相互独立，通过2.5D封装共同安装于同一中介层。    

    每个HBM模块配备1024位I/O接口（共16通道），通过物理接口层（PHY）与XPU相连。而下一代HBM4将首次将I/O接口扩展至2048位，这将是自2015年HBM问世以来的最大规格变革。     在封装工艺上，目前主要存在两大技术路径：热压键合配合非导电膜（TC+NCF）和整体回流焊配合模塑底部填充（MR+MUF）。前者在应对芯片翘曲方面更具优势，但热阻较高且生产效率偏低；后者生产效率更高、热阻更低，却更易出现翘曲及间隙填充缺陷。    

    面向未来，SK海力士计划引入混合键合技术，以消除芯片堆叠中的凸块并缩小间距。同时，公司正在开发名为“I-HBM”的局部散热技术（类似三星的HPB方案），旨在优化传热路径，更高效地分散热量，为更高层数的堆叠铺路。

B |     在2.5D封装解决方案方面，SK海力士目前已在传统CoWoS-L、CoWoS-R和CoWoS-S之外，新增了英特尔的EMIB技术，形成更丰富的异构集成选项。     此外，市场传言SK海力士与英特尔有望在存储领域组建合资公司，进一步深化合作。同时，与三星类似，SK海力士也在积极推进3D垂直堆叠方案，将HBM直接置于计算模块之上，以突破现有封装架构的带宽和能效瓶颈。    

Current article:http://d1gr.dinggaxilianmaiyuejienianguai.shop/news/20260826_19858.html

Published on:09:39:45